The top board of the BGA adapter is designed to accept various variations of BGA (Ball Grid Array) packages, including different ball diameters, ball heights, and body thicknesses. The Accepted package(s) section of the adapter shows the range of dimensions for BGA packages that can be used with this BGA-Top board.

The ZIF (Zero Insertion Force) socket used in this adapter is a BGA80 type, which features a depopulated array of 64 spring probes. It has a ClamShell type design, allowing for easy and secure insertion and removal of BGA packages. The ZIF socket has an operating (mechanical) warranty of 500,000 actuations, ensuring reliable and durable performance for frequent device insertions and removals.

The BGA-Top board has 4 rows of 4×25 pins arranged in a square pattern, with a pitch of 0.6×0.6mm (600 mil), for connection to the BGA-Bottom-X board. The BGA-Top board is made in Slovakia and identified by Ord. no. 70-0263, and it is compatible with a wide range of BGA packages due to its versatile ZIF socket design.