The top board of the BGA adapter with Ord. no. 70-0581 is designed to accept various BGA (Ball Grid Array) packages, including different variations in ball diameter, ball height, and body thickness. The ZIF (Zero Insertion Force) socket on this top board is capable of accommodating a wide range of BGA packages, as indicated in the picture in the “Accepted package(s)” section, which displays the dimensions of BGA packages that are compatible with this adapter.

This BGA-Top board is manufactured in Slovakia and comes with a mechanical warranty of 10,000 actuations for the ZIF socket, ensuring durability and reliable performance during repeated use.

The ZIF BGA100 socket on this top board is of the OpenTop type, which allows for easy insertion and removal of BGA packages without applying excessive force. The connection to the BGA-Bottom board is made through 8 rows of 25 pins each, along with 3 rows of 20 pins, arranged in a square pattern with a pin pitch of 0.6×0.6mm. This configuration provides a secure and efficient connection to the BGA packages, enabling accurate programming or testing of the devices.