The top board of the BGA adapter with Ord. no. 70-0559 is designed to accept various variations of BGA (Ball Grid Array) packages, including different ball diameter, ball height, and body thickness. The ZIF (Zero Insertion Force) socket on the top board is designed to accommodate a wide range of BGA packages, as depicted in the Accepted package(s) section of the picture.

The ZIF socket on this BGA adapter is of ClamShell type, which provides ease of use and secure connection for BGA devices. It has an operating (mechanical) warranty of 500,000 actuations, ensuring durability and reliability in repeated usage.

The BGA-Top board is made in Slovakia, adhering to high manufacturing standards to ensure quality and reliability. The Ord. no. 70-0559 serves as a unique identifier for this specific BGA adapter, making it easy to identify and track in a professional environment.

The Connection to BGA-Bottom-X is designed with 8×25 + 3×20 pins in a square pattern, with a pin pitch of 0.6×0.6mm. This configuration provides a reliable and efficient interface between the top board and the bottom board of the BGA adapter, allowing for easy and secure connection during programming or testing of BGA devices.