The top board of the BGA adapter is designed with a ZIF (Zero Insertion Force) socket that can accept various variations of BGA (Ball Grid Array) packages, including those with different ball diameter, ball height, and body thickness. The Accepted package(s) section of the adapter includes a range of dimensions that are compatible with the BGA-Top board, ensuring versatility and compatibility with different BGA packages.

The ZIF socket on the top board of the BGA adapter is of OpenTop type, providing easy insertion and removal of BGA packages for programming and testing purposes. The operating (mechanical) warranty of the ZIF socket is 10,000 actuations, ensuring reliable and durable performance over multiple cycles of insertion and removal.

The top board is made in Slovakia, known for its high-quality manufacturing standards, and has an order number of 70-0976 for easy identification and ordering. It features a connection to BGA-Bottom-X with an 8×25 + 3×20 pin configuration, with square pins measuring 0.6×0.6mm. This configuration is designed to provide a secure and reliable connection between the top and bottom boards of the BGA adapter, ensuring proper alignment and connection during programming and testing processes.

With its ZIF socket that accepts various BGA packages, high-quality manufacturing in Slovakia, and a mechanical warranty of 10,000 actuations, the top board of the BGA adapter with the ord. no. 70-0976 is a reliable solution for programming and testing BGA devices. Its versatility, durability, and performance make it suitable for professional use in a wide range of applications.