The top board of this BGA adapter is designed to accept a wide range of BGA packages, including those with variations in ball diameter, ball height, and body thickness. The Accepted package(s) section of the adapter’s documentation includes a picture showing the range of all dimensions of BGA packages that are compatible with this BGA-Top board.

The ZIF socket used in this BGA adapter has an operating (mechanical) warranty of 500,000 actuations, indicating its high durability and reliability for repeated use. The ZIF socket is of the ClamShell type, allowing for easy insertion and removal of the BGA package during programming and testing operations.

The BGA-Top board is manufactured in Slovakia with high quality standards to ensure reliable performance. The order number for this BGA adapter is 70-0865, and it is suitable for use with BGA76 packages with a depopulated array of 60 spring probes. The connection to the BGA-Bottom-X is made through 4×25 pins, arranged in a square pattern with a pitch of 0.6×0.6mm, providing a reliable connection to the BGA package during programming and testing operations.