BGA-Bottom-77

SKU: ELNx2149 Brand:

AED 2,746.65

Available on backorder

Available on backorder

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Stock Location Shipping Method ETA Cost
Available Abu Dhabi Self Pickup Wednesday-Saturday: Will be available for pick up on Tuesday Sunday-Tuesday: Will be available for pickup on Thursday Free
Available Dubai Self Pickup 1-2 Days Free
Available UAE Remote Areas Delivery 4-5 days 22 AED / Free Above 50 AED
Available UAE Urban Areas Delivery 2-3 Days 22 AED / Free Above 50 AED
Available International Delivery 4-7 days 180 AED | 49 $
Pre-Order General 2-3 weeks

Payment Methods:

BGA-Bottom-77 payments method new 403 by 26 1

Product Description:

The bottom board of the BGA adapter with order number 70-0760 is designed specifically for use with PLD (Programmable Logic Device) Lattice ispXPGA devices in a BGA256 package. This adapter is made in Slovakia, ensuring high-quality construction and performance.

The connection to the BGA-Top-X features 8×25 sockets for wire wrap pins, along with 3×20 sockets for additional wire wrap pins, providing a reliable and secure connection for programming and interfacing with the ispXPGA device.

The bottom board of the adapter features 2 rows of 2×24 pins arranged in a square pattern, with a pin pitch of 0.6×0.6mm and rows spacing of 600mil. These pins provide the necessary connections for interfacing with the PLD Lattice ispXPGA device in the BGA256 package, enabling data transfer and programming operations.

This bottom board of the BGA adapter is supported from PG4UW software version 3.35o, ensuring compatibility with the programming software. The order number for this bottom board is 70-0760, and it is specifically designed for use with PLD Lattice ispXPGA devices in a BGA256 package. It is made in Slovakia to high-quality standards, ensuring reliable performance in programming and interfacing applications.

Product Attributes :

Specification

Brand

ELNEC

Unit Of Measure

Each

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