LGA-Bottom-121

The bottom board of the BGA adapter is designed specifically for Samsung K9LAG08U1A-I devices in U(T)LGA52 package. It is optimized for wire wrap pin connection to the BGA-Top-X, providing a reliable and secure connection during programming and testing.



The BGA adapter is manufactured in Slovakia, known for its high-quality manufacturing standards, ensuring reliability and performance. The order number for this adapter is 70-0924, which can be used for easy identification and ordering.



The bottom board of the BGA adapter features 2x24 pins arranged in a square pattern with a pitch of 0.6x0.6mm and rows spacing of 600mil. This ensures a reliable connection to the devices and accurate operations during programming and testing.



The connection to the BGA-Top-X is achieved through 4x25 sockets specifically designed for wire wrap pin connection. This provides a secure and stable connection, ensuring reliable programming and testing of Samsung K9LAG08U1A-I devices in U(T)LGA52 package.