BGA-Top-30 ZIF-CS

The top board of the BGA adapter, with Ord. no. 70-0348, is a versatile and high-quality solution designed to accept a wide range of BGA packages with varying ball diameter, ball height, and body thickness. The ZIF socket on this top board is capable of accommodating different BGA packages, as shown in the Accepted package(s) section of the provided picture, making it a versatile option for programming and testing operations.



With a ZIF BGA88 socket, which features a depopulated array of 66 spring probes, this top board is of ClamShell type, providing a secure and reliable connection to the BGA packages. The socket has an operating (mechanical) warranty of 500,000 actuations, ensuring its durability and long-term performance.



The top board of the BGA adapter, with Ord. no. 70-0348, has a connection to the BGA-Bottom-X board with 4 rows of 4x 25 pins each. The pins are arranged in a square shape with a pitch of 0.6x0.6mm, providing precise and reliable connections to the BGA packages during programming and testing operations.



This top board of the BGA adapter is made in Slovakia using high-quality materials and manufacturing processes to ensure its durability and performance. It is a reliable solution for programming and testing a wide range of BGA packages with varying dimensions, making it suitable for professional use in various applications.