BGA-Top-160 ZIF-CS

The top board of the BGA adapters features a ZIF (Zero Insertion Force) socket that can accept various variations of BGA (Ball Grid Array) packages, including those with different ball diameter, ball height, and body thickness. The picture in the Accepted package(s) section displays the range of dimensions of BGA packages that are compatible with this BGA-Top board. The ZIF socket has an operating (mechanical) warranty of 500,000 actuations, ensuring durability and reliability in frequent usage scenarios.



This top board is made in Slovakia, known for its high-quality manufacturing standards, and has an order number of 70-0957 for easy identification and ordering. The socket on the top board is a ZIF BGA81 ClamShell type, designed to securely hold BGA81 packages in place during testing or programming. The connection to the BGA bottom board is established through 8x25 3x20 pins, arranged in a square configuration with a size of 0.6x0.6mm, providing a reliable and robust connection.



The top board of BGA adapters, with its ZIF BGA81 ClamShell socket, is designed for compatibility with various BGA packages and is made in Slovakia with an order number of 70-0957. It features a connection to the bottom board through 8x25 3x20 pins in a square configuration of 0.6x0.6mm, and the ZIF socket has an operating (mechanical) warranty of 500,000 actuations, making it suitable for high-volume testing or programming applications.