BGA-Top-151 ZIF

The top board of the BGA adapters is designed to accept a wide range of BGA (Ball Grid Array) packages, including variations in ball diameter, ball height, and body thickness. The Accepted package(s) section of the adapter features a picture that shows the range of dimensions of BGA packages that can be accommodated by this BGA-Top board. The ZIF (Zero Insertion Force) socket on the top board has a mechanical warranty of 10,000 actuations, ensuring durability and reliability. The adapter is made in Slovakia and comes with an order number of 70-0816. The socket is of the OpenTop type, providing easy insertion and removal of the BGA package. The connection to the BGA-Bottom-X is through 4x25 pins arranged in a square pattern with a pin pitch of 0.6x0.6mm. This top board of the BGA adapter is designed to provide a reliable solution for programming and testing various BGA packages, making it suitable for development and production environments.