BGA-Top-140 ZIF-CS

The top board of this BGA adapter is designed to accept various variations of BGA (Ball Grid Array) packages, which may differ in ball diameter, ball height, and body thickness. The Accepted package(s) section of the product's picture shows the range of dimensions of BGA packages that can be accommodated by this BGA-Top board.



The ZIF (Zero Insertion Force) socket on this top board features a depopulated array of 63 spring probes, making it compatible with BGA79 packages. The ClamShell type of the ZIF socket allows for easy insertion and removal of the BGA package during programming and testing.



The ZIF socket has an operating (mechanical) warranty of 500,000 actuations, ensuring its durability and reliable performance during repeated usage. The top board of this BGA adapter is manufactured in Slovakia and is identified by the order number (Ord. no.) 70-0799.



The connection to the BGA-Bottom-X is facilitated by 4x25 pins in a square configuration, with a pin pitch of 0.6x0.6mm. This configuration allows for easy and secure connection of the BGA package to the adapter during programming and testing operations.