BGA-Top-134 ZIF

The top board of the BGA adapters with order number 70-0742 features a ZIF (Zero Insertion Force) socket that is designed to accept various variations of BGA (Ball Grid Array) packages. These BGA packages may differ in ball diameter, ball height, and body thickness. The accepted package(s) section of the adapter includes a picture that shows the range of dimensions of BGA packages that can be used with this BGA-Top board.



The ZIF socket on this top board has an operating (mechanical) warranty of 10,000 actuations, ensuring its durability and long-term performance. The BGA-Top board is manufactured in Slovakia to high-quality standards, ensuring reliability and performance. The ZIF socket is of OpenTop type, making it easy to insert and remove BGA packages during programming and testing operations.



The order number for this BGA-Top board is 70-0742, and it is designed to accept BGA179 packages (accepts packages with up to 196 balls). The connection to the BGA-Bottom-X board includes 8 3 rows of pins, with 8x25 pins in the main area and 3x20 pins in a smaller area, arranged in a square pattern with a pin pitch of 0.6x0.6mm. This provides precise and secure connections for efficient programming and testing of BGA packages.



With its ZIF socket's high actuation warranty, open-top design, and manufacturing in Slovakia to high-quality standards, this BGA-Top board with order number 70-0742 offers a reliable and efficient solution for programming and testing of BGA179 packages and other compatible BGA packages.