BGA-Top-130 ZIF-CS

The top board of the BGA adapters with order number 70-0722 features a ZIF (Zero Insertion Force) socket that is capable of accepting various BGA (Ball Grid Array) packages with different ball diameters, ball heights, and body thicknesses. The Accepted package(s) section of the adapter provides a picture that shows the range of dimensions of BGA packages that are compatible with this BGA-Top board.



The ZIF socket on this top board is of ClamShell type, and it is designed with a depopulated array of 80 spring probes. It has an operating (mechanical) warranty of 500,000 actuations, ensuring long-lasting durability and reliability during repeated use in programming and testing processes.



The top board of the BGA adapter is manufactured in Slovakia to high-quality standards. The order number for this adapter is 70-0722, and it is specifically designed for use with BGA100 packages. The connection to the BGA-Bottom-X is made through 4x25 pins arranged in a square configuration with a pin pitch of 0.6x0.6mm, providing precise and secure connections to the bottom board for programming and testing purposes.



With its ZIF socket capable of accepting a wide range of BGA packages, high operating (mechanical) warranty of 500,000 actuations, and durable ClamShell type design, this top board of the BGA adapter offers reliable and convenient programming and testing solutions for BGA100 packages in various applications.