BGA-Top-122 ZIF-CS

The top board of the BGA adapters, with order number 70-0659, features a ZIF (Zero Insertion Force) socket that is capable of accepting various variations of BGA (Ball Grid Array) packages with different ball diameter, ball height, and body thickness. The accepted package(s) are shown in the picture in the Accepted package(s) section, providing a range of dimensions for compatibility.



The ZIF socket on this BGA-Top board is of ClamShell type and is designed with a depopulated array of 48 spring probes, providing a reliable and secure connection for BGA92 packages. The ZIF socket has an operating (mechanical) warranty of 500,000 actuations, ensuring durability and longevity even with frequent use.



The BGA-Top board is manufactured in Slovakia with the order number 70-0659. It features a connection to the BGA-Bottom-X with 4 rows of 4x25 pins, arranged in a square layout with a dimension of 0.6x0.6mm and a row spacing of 600mil. This configuration provides efficient and reliable connectivity for programming and testing purposes for BGA92 packages.



The BGA-Top board with ZIF BGA92 ClamShell type socket is designed to provide a high-quality solution for programming and testing BGA92 packages, and it is suitable for various applications where precise and reliable connectivity is required.