BGA-Top-121 ZIF-CS

The top board of the BGA adapter features a ZIF (Zero Insertion Force) socket that is designed to accept various variations of BGA (Ball Grid Array) packages, including those with different ball diameter, ball height, and body thickness. The Accepted package(s) section of the adapter includes a picture that shows the range of dimensions of BGA packages that are compatible with this BGA-Top board.



The ZIF socket on the top board is a ClamShell type, which allows for easy insertion and removal of the BGA packages during programming and testing. It has an operating (mechanical) warranty of 500,000 actuations, ensuring durability and reliability during repeated use.



The BGA adapter is manufactured in Slovakia and is identified by the order number 70-0653. The top board is specifically designed with a ZIF BGA64 socket, tailored for BGA64 packages. The connection to the BGA-Bottom-X board is through 4x25 pins, arranged in a square layout with a dimension of 0.6x0.6mm.