BGA-Top-116 ZIF

The top board of the BGA adapter with Ord. no. 70-0632 features a ZIF (Zero Insertion Force) socket that is designed to accept various BGA (Ball Grid Array) packages with different ball diameter, ball height, and body thickness dimensions. The accepted package(s) range is shown in the picture at the Accepted package(s) section of the adapter.



The ZIF socket on this BGA adapter has an operating (mechanical) warranty of 10,000 actuations, ensuring reliable performance for multiple insertions and removals of BGA packages. The BGA adapter is made in Slovakia, known for its high-quality manufacturing standards, ensuring durability and reliability.



The Ord. no. 70-0632 BGA adapter features a ZIF BGA48 socket on the top board, with an OpenTop type design. It is designed to connect to a BGA-Bottom-X with 4x25 pins arranged in a square pattern with a pin pitch of 0.6x0.6mm.



This BGA adapter is a reliable solution for working with various BGA packages, offering a ZIF socket with a wide range of accepted package dimensions, high-quality manufacturing, and a mechanical warranty for reliable performance. It is suitable for applications that require programming or testing of BGA devices with BGA48 packages.