BGA-Bottom-77

The bottom board of the BGA adapter with order number 70-0760 is designed specifically for use with PLD (Programmable Logic Device) Lattice ispXPGA devices in a BGA256 package. This adapter is made in Slovakia, ensuring high-quality construction and performance.



The connection to the BGA-Top-X features 8x25 sockets for wire wrap pins, along with 3x20 sockets for additional wire wrap pins, providing a reliable and secure connection for programming and interfacing with the ispXPGA device.



The bottom board of the adapter features 2 rows of 2x24 pins arranged in a square pattern, with a pin pitch of 0.6x0.6mm and rows spacing of 600mil. These pins provide the necessary connections for interfacing with the PLD Lattice ispXPGA device in the BGA256 package, enabling data transfer and programming operations.



This bottom board of the BGA adapter is supported from PG4UW software version 3.35o, ensuring compatibility with the programming software. The order number for this bottom board is 70-0760, and it is specifically designed for use with PLD Lattice ispXPGA devices in a BGA256 package. It is made in Slovakia to high-quality standards, ensuring reliable performance in programming and interfacing applications.