BGA-Bottom-76

The bottom board of the BGA adapter with order number 70-0713 is designed for use with Samsung One NAND (KFH2G16Q2M-DEB6) in a matrix of 8x6 BGA package. This adapter provides a reliable and convenient solution for programming and testing Samsung One NAND devices during development and production processes.



The bottom board of the BGA adapter features 2 rows of 2x24 pins in a square configuration, with a pin pitch of 0.6x0.6mm and row spacing of 600mil. This configuration is specifically designed for compatibility with Samsung One NAND devices in a matrix of 8x6 BGA package, providing precise and secure connections for programming and testing purposes.



The connection to BGA-Top-X on the top side of the adapter features 4 rows of sockets for 4x25 wire wrap pins, allowing for easy and reliable connections to the Samsung One NAND device for programming and testing purposes.



The BGA adapter is made in Slovakia to high manufacturing standards, ensuring quality and reliability. The order number for this BGA adapter is 70-0713, and it is designed for use with Samsung One NAND (KFH2G16Q2M-DEB6) devices in a matrix of 8x6 BGA package.