BGA-Bottom-63

The bottom board of BGA adapters, assigned for FPGA devices LatticeXP in matrix 16x16, is designed to provide a reliable connection between the FPGA device and the BGA-Top-X board. It is manufactured in Slovakia and is assigned with order number 70-0679.



The bottom board features sockets for 8x25 3x20 wire wrap pins, arranged in 8 3 rows. These sockets provide a secure and stable connection for the FPGA device, allowing for programming and testing with confidence.



The bottom board also includes 2 rows of 2x24 pins, with a square layout and a pin pitch of 0.6x0.6mm. The row spacing is 600mil, providing compatibility with standard PCB layouts. These pins are designed to securely connect to the corresponding BGA package on the FPGA device, ensuring reliable communication and performance.



The bottom board of BGA adapters for LatticeXP devices in matrix 16x16 is a high-quality, made-in-Slovakia product with order number 70-0679. It is designed to provide a reliable and efficient connection between the FPGA device and the BGA-Top-X board, enabling smooth programming and testing operations.