BGA-Bottom-57

The bottom board of the BGA adapter with Ord. no. 70-0601 is specifically designed for use with the Atmel AT89C51SND2C microcontroller, which is available in a matrix package with a 10x10 array of pins. The bottom board is made in Slovakia, known for its high-quality manufacturing standards.



The connection to the BGA-Top-X is designed with 8 3 rows of sockets for wire wrap pins, with 8x25 pins in the main area and 3x20 pins in a smaller area. This configuration allows for proper alignment and connection to the BGA-Top board, which has a corresponding pinout for the AT89C51SND2C microcontroller.



The bottom board itself features 2 rows of sockets with 2x24 pins each, arranged in a square pattern with a pin pitch of 0.6x0.6mm and rows spacing of 600mil. This configuration is compatible with the pinout of the AT89C51SND2C microcontroller, ensuring proper alignment and connection during programming or testing.