BGA-Bottom-55

The bottom board of the BGA adapter with Ord. no. 70-0566 is designed for use with STR710 devices in a matrix configuration of 12x12. The bottom board is made in Slovakia, adhering to high manufacturing standards to ensure quality and reliability.



The Connection to BGA-Top-X is designed with 8 3 rows of sockets for 8x25 3x20 wire wrap pins. This configuration provides a reliable and efficient interface between the top board and the bottom board of the BGA adapter, allowing for easy and secure connection during programming or testing of STR710 devices.



The bottom board features 2 rows of 2x24 pins in a square pattern, with a pin pitch of 0.6x0.6mm and rows spacing of 600mil. This layout is designed to provide a reliable and efficient connection to the STR710 device, ensuring accurate programming or testing results.