BGA-Bottom-53

The bottom board of the BGA adapter with Ord. no. 70-0574 is specifically designed for use with Intel RD/LF38/48FxxxxW/L microcontrollers in a matrix of 10x8 BGA package. This bottom board is manufactured in Slovakia, adhering to high-quality standards to ensure reliable performance.



The bottom board features 4 rows of sockets for 4x25 wire wrap pins, allowing for a secure and efficient connection to the BGA-Top-X board. These sockets are designed to provide a reliable connection for programming or testing purposes.



The bottom board also has 2 rows of 2x24 pins in a square pattern, with a pin pitch of 0.6x0.6mm. The pins are spaced at a pitch of 600mil, providing a reliable and efficient connection to the Intel RD/LF38/48FxxxxW/L microcontrollers in the BGA package. The bottom board is designed to ensure accurate programming or testing results.