BGA-Bottom-31

The bottom board of the BGA adapter with Ord. no. 70-0442 is specifically designed for use with Flash devices in a matrix of 8x8 configuration. The adapter is made in Slovakia and is constructed to high-quality standards to ensure reliable performance.



The bottom board features 2 rows of 2x 24 pins each, arranged in a square pattern with a pin spacing of 0.6x0.6mm and rows spacing of 600mil. These pins are designed to provide a reliable electrical connection to the Flash devices in the 8x8 matrix configuration.



The adapter also has 4 rows of sockets for 4x 25 wire wrap pins, which are used for connection to the corresponding pins on the top side of the BGA package. This enables easy and secure connection of the Flash devices to the adapter for programming or testing purposes.



The Ord. no. 70-0442 serves as a unique identifier for this specific adapter, making it easy to identify and track in a professional environment. It is important to verify the compatibility of the adapter with the specific Flash device model and package type before proceeding with programming or testing operations to ensure proper functionality and avoid potential damage to the Flash device or the adapter.