BGA-Bottom-257

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bottom board of BGA adapters, assigned for Samsung K9F5608/16, MICRON MT29F2G16ABDHC-ET devices in matrix 8x6

made in Slovakia

Ord. no. 70-2362

Connection to BGA-Top-X 4x25 sockets for wire wrap pin

Bottom 2x24 pins, square, 0.6x0.6mm, rows spacing 600mil

More Information
Brand Elnec
GTIN 1,
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Stock

Shipping Method

ETA

Cost

Available

Self Pickup

1 Day

Free

Available

inside UAE

2 - 3 Days

22 AED / Free Above 50 AED

Available

International

4 - 7 Days

180 AED / 49 $

pre-order

General

2 Weeks

 

BGA-Bottom-257

AED 576.57