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bottom board of BGA adapters, assigned for NAND flash devices in 100-ball BGA packages with ONFI 2.x compatible pinout (asynchronous and/or SDR interface support)
made in Slovakia
Ord. no. 70-2331
Connection to BGA-Top-X 4x25 sockets for wire wrap pin
Bottom 2x24 pins, square, 0.6x0.6mm, rows spacing 600mil
| Estimated Delivery | Lead Time 2-3 Weeks |
|---|
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Stock |
Shipping Method |
ETA |
Cost |
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|
Available |
Self Pickup |
1 Day |
Free |
|
|
Available |
inside UAE |
2 - 3 Days |
22 AED / Free Above 50 AED |
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|
Available |
International |
4 - 7 Days |
180 AED / 49 $ |
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pre-order |
General |
4-5 Weeks |
