BGA-Bottom-19

The bottom board of BGA adapters with Ord. no. 70-0448 is designed for Flash devices in a matrix 8x8 configuration. The bottom board is made in Slovakia to high-quality standards, ensuring reliable performance.



The connection to BGA-Top-X is facilitated through 4 rows of sockets for 4x 25 wire wrap pins, allowing for a secure electrical connection to the corresponding pins on the BGA (Ball Grid Array) package.



The bottom board features 2 rows of 2x 24 pins each, arranged in a square pattern with a pin spacing of 0.6x0.6mm and rows spacing of 600mil. This design allows for a reliable electrical connection to the Flash devices in a matrix 8x8 configuration, enabling efficient testing, programming, or other operations.



The Ord. no. 70-0448 serves as a unique identifier for this specific bottom board of the BGA adapter, making it easy to identify and track in a professional environment. It is important to verify the compatibility of the bottom board with the specific Flash devices and matrix configuration before proceeding with any operations to ensure proper functionality and avoid potential damage to the devices or the adapter.