BGA-Bottom-18

The bottom board of BGA adapters with Ord. no. 70-0474 is specifically designed for devices such as SST SST32HF162C/164C/324C and SST34HF162C/164C/162G/164G, in a matrix configuration of 8x6. This bottom board is intended for use in conjunction with a BGA-Top-X adapter with 4x25 sockets for wire wrap pins.



This bottom board is supported from PG4UW software version 3.04e, ensuring compatibility with the designated devices and programming software. It is made in Slovakia, adhering to high-quality standards for reliable performance.



The bottom board features 2x24 pins arranged in a square pattern with a pin spacing of 0.6x0.6mm and a row spacing of 600mil. These pins are designed to provide a secure and reliable connection to the target devices, ensuring efficient programming or testing operations.



The Ord. no. 70-0474 serves as a unique identifier for this specific bottom board, making it easy to identify and track in a professional environment. It is important to follow the manufacturer's guidelines for proper usage of the bottom board and the corresponding BGA-Top-X adapter to ensure correct functionality and avoid potential damage to the devices or the adapter.