BGA-Bottom-177

The bottom board of the BGA adapter with Ord. no. 70-1069 is specifically designed for use with TI Stellaris (Luminary Micro) devices in a matrix 16x16 configuration, such as the LM3S2965. This bottom board is manufactured in Slovakia to high-quality standards, ensuring durability and reliable performance.



The adapter features a connection to BGA-Top-X using 8x25 3x20 sockets for wire wrap pins. This allows for easy and secure connection of the top board to the bottom board, ensuring proper electrical connectivity between the target device and the adapter.



The bottom board of the adapter features 2x24 square pins with a size of 0.6x0.6mm and a row spacing of 600mil. These pins are designed to provide accurate alignment and electrical connectivity with the target TI Stellaris (Luminary Micro) device in the matrix 16x16 BGA package.