BGA-Bottom-115

The bottom board of the BGA adapter is designed for programming and testing Intel PF38F4060M0Y3CE flash memory devices in a matrix of 12x9 configuration. It provides a reliable and efficient solution for working with these specific devices in a convenient and user-friendly manner.



The bottom board features a connection to the BGA-Top-X using 8x25 3x20 sockets for wire wrap pins, ensuring a secure and reliable connection to the target flash memory device. This configuration allows for easy programming and testing of the Intel PF38F4060M0Y3CE devices.



The bottom board also has 2x24 pins arranged in a square pattern with a pitch of 0.6x0.6mm and rows spacing of 600mil. This configuration provides a secure and reliable connection to the programming and testing equipment, ensuring accurate and efficient operations.



The bottom board is manufactured in Slovakia, known for its high-quality manufacturing standards, ensuring reliability and durability. The order number for this bottom board of the BGA adapter is 70-0893, which can be used for easy identification and ordering.



In summary, the bottom board of the BGA adapter is designed for Intel PF38F4060M0Y3CE flash memory devices in a matrix of 12x9 configuration. It features a connection to the BGA-Top-X using 8x25 3x20 sockets for wire wrap pins, has 2x24 pins arranged in a square pattern, and is manufactured in Slovakia. The order number for this bottom board is 70-0893.