BGA-Bottom-105

The bottom board of BGA adapters with Ord. no. 70-1020 is specifically designed for Flash devices in a matrix of 12x8 ball grid array (BGA) configuration. It is made in Slovakia and includes a connection to BGA-Top-X with 4x25 sockets for wire wrap pins, allowing for reliable connection to the BGA package. The bottom board features 2x24 pins arranged in a square shape with dimensions of 0.6x0.6mm, and a row spacing of 600 mil, which is compatible with standard pin configurations.



This bottom board is suitable for use in programming or development applications that require interfacing with Flash devices in a 12x8 BGA matrix. It provides a reliable and durable solution for connecting to BGA packages, ensuring proper signal transmission and programming operations.