BGA-Bottom-102

The bottom board of the BGA adapter is specifically designed for Actel ProASIC3, ProASIC3L, and IGLOO devices in a matrix 12x12 configuration. This bottom board provides a reliable and efficient solution for programming and testing these devices in BGA (Ball Grid Array) package.



The BGA-Top-X connection on the bottom board consists of 8x25 sockets and 3x20 sockets for wire wrap pins. This configuration provides a secure and reliable connection to the corresponding BGA-Top-X, ensuring accurate programming and testing of Actel ProASIC3, ProASIC3L, and IGLOO devices.



The bottom board features a 2x24 pin configuration, arranged in a square pattern with a pitch of 0.6x0.6mm and rows spacing of 600mil. This configuration provides a stable and reliable interface for connecting the bottom board to the target device, ensuring accurate and efficient programming and testing.



The bottom board is manufactured in Slovakia, known for its high-quality manufacturing standards, ensuring reliability and durability. The order number for this bottom board is 70-0886, which can be used for easy identification and ordering.



The bottom board of the BGA adapter is designed to provide a reliable and efficient solution for programming and testing Actel ProASIC3, ProASIC3L, and IGLOO devices in a matrix 12x12 configuration. It is manufactured to high-quality standards in Slovakia, ensuring durability and performance.