Specifications:

specialized programming module for NAND flash devices in BGA63 package 13x10.5x max 1.2 mm, pitch 0.8mm, grid 12x10
used ZIF socket may accept one or more variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
operating (mechanical) warranty of ZIF socket – 10,000 actuations
supported from PG4UW software version 3.09
made in Slovakia
Ord. no.        73-3167
Socket        ZIF BGA63, OpenTop type
Bottom        2 connectors by 68 pins, receptacle type