Specifications:

specialized programming module for Toshiba NAND Flash devices in package BGA63 11x9mm, pitch 0.8mm and low height balls
used ZIF socket may accept one or more variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
operating (mechanical) warranty of ZIF socket – 10,000 actuations
supported from PG4UW software version 3.37a
made in Slovakia
Ord. no.        73-4455
Socket        ZIF BGA63, OpenTop type
Bottom        2 connectors by 68 pins, receptacle type