Specifications:

specialized programming module for MCP NAND flash in BGA130 package 9x8x max1.0 mm, pitch 0.65mm, matrix 13x10
used ZIF socket may accept one or more variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
operating (mechanical) warranty of ZIF socket – 10,000 actuations
supported from PG4UW software version 3.09
made in Slovakia
Ord. no.        73-3169
Socket        ZIF BGA130, OpenTop type
Bottom        2 connectors by 68 pins, receptacle type