JU-110-3 is your cutting-edge solution for SMT (Surface Mount Technology) adhesive needs, specifically designed to meet the rigorous requirements of modern electronics manufacturing. This high-performance adhesive ensures both precision and compliance, making it an ideal choice for your assembly processes involving 1005 chip components.

Designed for Precision:

With the capability to cater to the smallest of chip components (1005 size), JU-110-3 guarantees impeccable performance. Its stability and tall deposit characteristics assure reliable contact even with these minute components, thereby enhancing the overall reliability of your wave soldering process.

Shape Retention for Unmatched Reliability:

One of the standout features of JU-110-3 is its outstanding shape retention ability. This unique property facilitates the consistent application of tall print deposits, ensuring unfaltering contact with surface-mounted components of varying shapes. This reliability boost significantly contributes to the success of your assembly processes.

Heat Slump Resistance:

JU-110-3's resilience against heat slump is a game-changer. Throughout your manufacturing process, the adhesive maintains the height of deposits, even when subjected to elevated temperatures. This steadfastness in deposit height ensures a secure hold on components during heating stages, preventing any compromise in component placement.

Compliance and Responsibility:

We understand the importance of adhering to regulations in modern manufacturing. JU-110-3 is designed with your compliance needs in mind. It contains significantly reduced levels of substances of very high concern (SVHC), aligning perfectly with the requirements set by the European Chemical Agency (ECHA) and the REACH regulation. Choosing JU-110-3 not only ensures peak performance but also demonstrates your commitment to environmental and regulatory responsibilities.