Connector System : Wire-to-Board
Number of Positions : 34
Centerline (Pitch) : 2.54 mm [ .1 in ]
Row-to-Row Spacing : 2.54 mm [ .1 in ]
Number of Rows : 2

Specifications:

Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness (µin): 30
Wire Contact Termination Area Plating Material : Tin
Wire Contact Termination Area Plating Thickness : 2.54 µm [ 100 µin ]
Mating Pin Diameter : .64 mm [ .025 in ]
Mating Square Post Dimension : .64 mm [ .025 in ]
Contact Current Rating (Max) (A): 1
Row-to-Row Spacing : 2.54 mm [ .1 in ]
Centerline (Pitch) : 2.54 mm [ .1 in ]