XGSP50,Solder Paste Sn63/Pb37,42G

SKU
TPSA0113
Part Number
XGSP50
Brand:
Estimated Delivery: Lead Time 4-6 Weeks
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The XGSP50 Solder Paste is a high-performance soldering solution designed for precision electronics repair and PCB assembly. Featuring a premium Sn63/Pb37 alloy, this leaded solder paste offers exceptional soldering performance, ensuring strong, reliable joints and reducing the likelihood of defects.

With a particle size range of 25-45um, the XGSP50 solder paste ensures consistent application and precise soldering, making it ideal for fine-pitch components and intricate PCB work. Its optimal viscosity allows for smooth application, holding components securely in place during the soldering process.

Packaged in a convenient 42-gram container, this solder paste provides ample quantity for multiple projects while ensuring it remains fresh and effective. The low melting point of the Sn63/Pb37 alloy makes this paste easy to work with, suitable for both professionals and DIY enthusiasts.

Whether you're working with SMD components, fine-pitch ICs, or general PCB assembly, the XGSP50 solder paste delivers reliable performance and excellent wetting properties, ensuring strong and durable connections. Compatible with various soldering methods, this paste is a versatile addition to any electronics toolkit.

Key Features :
  • Premium Leaded Solder Paste - The XGSP50 Solder Paste contains a high-quality Sn63/Pb37 alloy, providing excellent soldering performance and reliable joints for electronics repair and PCB assembly.
  • Consistent Particle Size - With a particle size range of 25-45um, this solder paste ensures consistent and precise soldering, ideal for fine-pitch components and intricate PCB work.
  • Optimal Viscosity - Formulated with the perfect viscosity for smooth application, this solder paste spreads evenly and holds components in place, reducing the risk of defects and rework.
  • 42G Convenient Packaging - The solder paste comes in a 42-gram container, offering ample quantity for multiple projects while ensuring freshness and long-lasting usability.
  • Low Melting Point - Featuring a low melting point, this Sn63/Pb37 solder paste is easy to work with, making it suitable for both professional technicians and DIY enthusiasts.
  • Excellent Wetting Properties - The XGSP50 solder paste offers excellent wetting properties, ensuring strong and reliable connections between components and the PCB.
More Information
Estimated Delivery Lead Time 4-6 Weeks
Type Solder Paste
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Shipping Method

ETA

Cost

Available

Self Pickup

1-2 Day

Free

Available

Inside Jordan

1 - 3 Days

3 JOD / Free Above 100 JOD

pre-order

General

3-5 Weeks