28-Pin Wire Wrap IC Socket – 0.6" Wide (DIP-28), Gold-Plated Machined Pins with Extended Square Posts for High-Reliability Prototyping

The 28-Pin Wire Wrap IC Socket is the premier choice for engineers, researchers, and hobbyists developing complex digital systems or restoring vintage hardware. Wire wrapping is a specialized technique that allows for dense point-to-point wiring without the need for a custom-manufactured PCB. This 28-pin variant is an industry standard for wide-body ICs, commonly used in embedded systems, memory modules, and legacy computing architectures. The primary advantage of these machined sockets is their "closed-bottom" design, which prevents solder or flux from wicking up into the contact area if the base of the posts is soldered to a board. The extended posts are specifically engineered to accommodate up to three layers of 30 AWG wire, allowing for complex logic signal routing on a single pin. Whether you are prototyping a custom Z80-based computer, building a high-reliability aerospace module, or developing a test fixture for parallel memory, these sockets provide a robust, professional-grade foundation. They offer the modularity of a breadboard with the long-term durability of a hard-wired system.

Key Features:

Machined 4-Finger Contacts: Equipped with precision-turned internal contacts that provide a high-pressure, multi-point grip on IC leads for superior vibration resistance.

Gold-Plated Signal Integrity: The inner "fingers" are gold-plated to prevent oxidation and ensure ultra-low contact resistance throughout the life of the prototype.

Standard 0.6" Row Spacing: Designed for "Wide" 28-pin DIP (Dual In-Line Package) components, perfectly fitting microcontrollers (like the ATmega328P-PU), EPROMs, and SRAM chips.

Gas-Tight Reliability: The sharp corners of the square posts create a gas-tight electrical bond when wrapped, providing a connection that is often more reliable than solder in harsh environments.

High-Durability Housing: Molded from glass-filled polyester (PBT), ensuring the socket remains stable under thermal stress and mechanical insertion forces.