32-Pin Wire Wrap IC Socket – 0.6" Wide (DIP-32), Gold-Plated Machined Pins with Extended Square Posts for High-Reliability Prototyping

The 32-Pin Wire Wrap IC Socket is a premium interconnect component engineered for high-density prototyping and mission-critical electronics development. Unlike standard solder-tail sockets, the wire wrap version allows for complex point-to-point wiring that is highly durable and easily modified. This 32-pin variant is the standard interface for wide-bodied integrated circuits commonly found in industrial controllers, vintage computing systems, and memory expansion modules. One of the primary advantages of this socket is its longevity and modularity. By using wire-wrapping instead of soldering, you can reconfigure your circuit logic on the fly without risking heat damage to the PCB traces or the IC itself. The machined pins are far superior to stamped-leaf contacts, offering a "closed-bottom" design that prevents flux or solder from wicking into the contact area if you choose to solder the posts to a board. Whether you are designing a custom 8-bit computer, prototyping a high-reliability aerospace module, or building a test fixture for parallel memory chips, these sockets provide a robust, professional-grade foundation. They offer the flexibility of a breadboard with the reliability of a permanent hardware installation.

Key Features:

Machined 4-Finger Contacts: Features precision-turned internal contacts that provide a high-pressure, multi-point grip on IC leads, ensuring excellent vibration resistance and signal stability.

Gold-Plated Internal Contacts: The inner "fingers" are gold-plated to prevent oxidation and ensure low contact resistance over the life of the component.

Standard 0.6" Row Spacing: Designed for "Wide" 32-pin DIP (Dual In-Line Package) components, perfectly fitting high-capacity EPROMs, SRAM chips, and various microcontrollers.

Gas-Tight Reliability: The sharp corners of the square posts bite into the wrapping wire to create a gas-tight electrical bond that prevents corrosion without the need for solder.

Stackable Frame Design: Features a low-profile, glass-filled PBT housing (UL94V-0) that is end-to-end and side-to-side stackable on standard 0.1" (2.54mm) pitch grid boards.