24-Pin Wire Wrap IC Socket – 0.6" Wide (DIP-24), Gold-Plated Long Square Posts for Prototyping and High-Reliability Interconnects

The 24-Pin Wire Wrap IC Socket is a specialized interconnect solution for engineers and hobbyists working on complex digital prototypes, vintage computer restoration, or high-reliability military and aerospace applications. Wire wrapping is a solderless technique that involves tightly coiling a thin wire around the sharp corners of the socket’s square posts, creating a cold-welded, highly durable electrical bond that is often superior to traditional soldering in high-vibration environments. These sockets are particularly valued for their versatility. The extended pins allow for multiple levels of connections on a single post, facilitating dense point-to-point wiring without the need for a custom PCB. The machined internal contacts are designed to accommodate a wide range of lead diameters, ensuring a secure fit for both vintage ceramic ICs and modern plastic DIP components. Using these sockets simplifies the debugging and modification process; since no solder is used on the wrapping side, circuits can be reconfigured quickly by simply unwrapping the wire. Whether you are building a custom Z80-based computer, prototyping an industrial controller, or performing high-temp testing where solder might fail, the 24-Pin Wire Wrap socket provides a robust and flexible foundation for your electronics.

Key Features:

Gold-Plated Contacts: Equipped with high-quality gold plating on the internal contacts to ensure low resistance, prevent oxidation, and maintain signal integrity over time.

Precision Machined Pins: Unlike standard stamped contacts, these sockets use machined four-finger inner contacts for superior retention and "gas-tight" connections with IC leads.

High-Durability Housing: Molded from flame-retardant, glass-filled polyester (PBT), providing excellent thermal stability during soldering and mechanical strength for repeated insertions.

Standard 0.6" Row Spacing: Designed for "Wide" DIP packages (600 mil), perfectly fitting 24-pin microprocessors, EPROMs, and memory ICs.

Stackable Design: The slim body profile allows for side-by-side and end-to-end stacking on standard 0.1" (2.54mm) pitch prototyping boards.