Specifications:

specialized adapter for Toshiba NAND Flash devices in package BGA63 11x9mm, pitch 0.8mm and low height balls
used ZIF socket may accept one or more variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
operating (mechanical) warranty of ZIF socket – 10,000 actuations
supported from PG4UW software version 3.37a,
s/n from 4457-00248 are supported from PG4UW software version 3.76
made in Slovakia
Ord. no.        70-4457
Socket        ZIF BGA63, OpenTop type
Bottom        2x24 pins, square, 0.6x0.6mm, rows spacing 600mil