FK202SA-3 ,Finger-Shaped Heatsink – TO-3 Package, 12.7mm Diameter, 8.0 K/W, Black Anodized Aluminum

The FK202SA-3 is a finger-shaped heatsink from Fischer Elektronik, designed specifically for power semiconductor cooling applications. It features a compact 12.7mm diameter and is optimized for TO-3 package mounting, making it ideal for high-performance thermal management. The heatsink is constructed from high-quality aluminum, ensuring excellent thermal conductivity and efficient heat dissipation. With a thermal resistance of 8.0 K/W, it effectively dissipates excess heat from electronic components, enhancing operational stability and longevity. The black anodized surface treatment not only improves thermal radiation but also provides corrosion resistance, ensuring durability in demanding environments. Its lightweight and robust design makes it an excellent choice for industrial power applications, amplifiers, voltage regulators, and high-power transistors requiring reliable cooling solutions.

Key Features:

• Finger-Shaped Heatsink for TO-3 Package – Designed for efficient cooling of power semiconductors.
• 12.7mm Diameter with Compact Form Factor – Suitable for applications with space constraints.
• High Thermal Efficiency (8.0 K/W) – Ensures effective heat dissipation and system reliability.
• Aluminum Construction – Provides excellent thermal conductivity and mechanical strength.
• Black Anodized Surface Treatment – Enhances heat dissipation and corrosion resistance.
• Ideal for Industrial and Power Electronics – Suitable for amplifiers, voltage regulators, and high-power transistor cooling.

Additional Specifications:

• Type: Finger Shaped Heatsink
• Attachment Method: TO-3
• Material: Aluminum
• Shape: Cylindrical
• Fin Height : 12.7mm