HY410,Heatsink Compounds,20ml

The HY410 Heatsink Compound is a highly efficient thermal interface material that ensures superior heat transfer between electronic components and heat sinks. Its high thermal conductivity allows for maximum heat dissipation, preventing overheating in critical systems like CPUs, GPUs, and other processors. The 20ML syringe packaging provides ample compound for multiple applications, and its non-electrically conductive formula ensures safety during use. With an easy-to-use syringe applicator, this thermal compound is perfect for both professional technicians and DIY electronics enthusiasts.

HY410 is compatible with a wide range of devices and offers long-lasting performance even under extreme temperature conditions. It helps to reduce component temperatures and improve overall system stability, extending the life of your devices. Whether you're building a high-performance gaming PC, repairing electronics, or maintaining server systems, HY410 is the ideal choice for thermal management solutions.

Key Features:

• High Thermal Conductivity: Efficiently transfers heat between surfaces, making it ideal for cooling processors, GPUs, and other electronic components.

• 20ML Capacity: Large capacity syringe provides ample compound for multiple applications, making it convenient for professionals and DIY enthusiasts.

• Non-Electrically Conductive: Ensures safety during application, preventing electrical shorts between components.

• Easy Application: Comes in a user-friendly syringe form for precise and mess-free application on delicate surfaces.

• Durable and Long-lasting: Designed to last through multiple thermal cycles, maintaining high performance over time.

• Universal Compatibility: Suitable for use with all types of heat sinks, CPUs, and GPUs in desktop computers, laptops, and servers.