BGA-Top-92 ZIF

The top board of the BGA adapters, assigned with order number 70-0682, features a ZIF (Zero Insertion Force) socket that is designed to accept various variations of BGA (Ball Grid Array) packages. These BGA packages may differ in ball diameter, ball height, and body thickness. The top board is manufactured in Slovakia and comes with a mechanical warranty of 10,000 actuations.



The ZIF socket on the top board is of BGA176 type and features an OpenTop design, allowing for easy insertion and removal of BGA packages. The socket is capable of accommodating BGA packages with 176 balls in a square arrangement, as indicated by the connection details to the BGA-Bottom-X board, which features 8 3 rows of 8x25 3x20 pins with a pin pitch of 0.6x0.6mm.



The top board is made to high-quality standards in Slovakia, and it is designed to provide a reliable and efficient connection for BGA packages during programming, testing, and other operations. With a mechanical warranty of 10,000 actuations, it offers durability and longevity, making it suitable for various applications requiring frequent insertion and removal of BGA packages. The order number for this top board of BGA adapters is 70-0682.