BGA-Top-54 ZIF

The top board of the BGA adapter with Ord. no. 70-0560 features a ZIF (Zero Insertion Force) socket that is designed to accept various variations of BGA (Ball Grid Array) packages, including different ball diameter, ball height, and body thickness. The Accepted package(s) section of the picture provides a range of all dimensions of BGA packages that are compatible with this BGA-Top board.



The ZIF socket on this BGA adapter is of OpenTop type, which allows for easy insertion and removal of BGA devices without the need for a clamshell mechanism. It has an operating (mechanical) warranty of 10,000 actuations, ensuring durability and reliability for repeated usage.



The BGA-Top board is made in Slovakia, adhering to high manufacturing standards to ensure quality and reliability. The Ord. no. 70-0560 serves as a unique identifier for this specific BGA adapter, making it easy to identify and track in a professional environment.



The Connection to BGA-Bottom-X is designed with 4x25 pins in a square pattern, with a pin pitch of 0.6x0.6mm. This configuration provides a reliable and efficient interface between the top board and the bottom board of the BGA adapter, allowing for easy and secure connection during programming or testing of BGA devices.