BGA-Top-36 ZIF-CS

The top board of the BGA adapter, identified by the order number 70-0655, is specifically designed to accommodate BGA66 packages using a ZIF (Zero Insertion Force) ClamShell type socket. This top board is manufactured in Slovakia and is equipped with a ZIF socket that is capable of accepting various variations of BGA packages with different ball diameter, ball height, and body thickness.



The ZIF socket on the top board has an operating (mechanical) warranty of 500,000 actuations, ensuring durability and reliability during frequent use. The socket is designed for easy insertion and removal of BGA devices, minimizing the risk of damage to the device or the adapter.



The top board features a connection to the BGA-Bottom-X board through 4 rows of 4x25 pins, arranged in a square layout with a dimension of 0.6x0.6mm. This allows for efficient and reliable connectivity between the top and bottom boards for programming and testing of BGA devices.



The top board also includes an Accepted package(s) section that shows the range of all dimensions of BGA packages that are compatible with the ZIF socket on the board. This ensures versatility and compatibility with various BGA packages, making it suitable for a wide range of applications.