BGA-Top-27 ZIF-CS

The top board of the BGA adapter is designed to accept a wide range of BGA packages with variations in ball diameter, ball height, and body thickness. The BGA-Top board features a ZIF (Zero Insertion Force) socket with a high mechanical warranty of 500,000 actuations, ensuring long-term reliability and durability.

The BGA-Top board is manufactured in Slovakia and is identified by Ord. no. 70-0323. It features a ZIF BGA80 socket with a depopulated array of 64 spring probes in a ClamShell type configuration, providing secure and efficient connection to BGA packages.

The connection to the BGA-Bottom-X is achieved through 4 rows of 4x25 pins, arranged in a square pattern with a pitch of 0.6x0.6mm. This versatile design allows for easy adaptation to various BGA packages, making it a reliable solution for BGA programming and testing operations.