BGA-Bottom-9

The bottom board of the BGA adapter, identified by Ord. no. 70-0328, is designed for use with Flash devices in a 14x14 matrix BGA package. This bottom board is manufactured in Slovakia and features a connection to the BGA-Top-X board through 6x27 sockets for wire wrap pins.



The bottom board is designed with 2 rows of 2x24 pins in a square pattern with a pitch of 0.6x0.6mm and a row spacing of 600mil. This configuration allows for a reliable and secure connection between the bottom and top boards for programming and testing of BGA devices in a 14x14 matrix.



The bottom board is specifically designed for use with Flash devices, providing support for programming and testing operations on these devices. Assembled with high-quality materials and manufacturing processes, this bottom board is made in Slovakia and identified by Ord. no. 70-0328, ensuring its reliability and durability for repeated use in BGA programming and testing applications.