BGA-Bottom-78

The bottom board of the BGA adapter with order number 70-0759 is designed specifically for use with PLD (Programmable Logic Device) Lattice ispXPLD devices in a matrix size of 16x16. This adapter is made in Slovakia, ensuring high-quality construction and performance.



The connection to the BGA-Top-X features 8x25 sockets for wire wrap pins, along with 3x20 sockets for additional wire wrap pins, providing a reliable and secure connection for programming and interfacing with the ispXPLD device.



The bottom board of the adapter features 2 rows of 2x24 pins arranged in a square pattern, with a pin pitch of 0.6x0.6mm and rows spacing of 600mil. These pins provide the necessary connections for interfacing with the PLD Lattice ispXPLD device, enabling data transfer and programming operations.



The order number for this bottom board of the BGA adapter is 70-0759, and it is specifically designed for use with PLD Lattice ispXPLD devices in a matrix size of 16x16. It is made in Slovakia to high-quality standards, ensuring reliable performance in programming and interfacing applications.