BGA-Bottom-73

The bottom board of the BGA adapters, assigned with order number 70-0683, is designed specifically for RENESAS DF2116VBG20MSJV FPGA device in a 15x15 matrix configuration. The bottom board is manufactured in Slovakia and features high-quality construction.



The connection to the BGA-Top-X board consists of 8 3 rows of sockets for 8x25 3x20 wire wrap pins, providing a reliable and efficient connection to the top board. The bottom board has 2 rows of 2x 24 pins in a square configuration, with a pin pitch of 0.6x0.6mm and row spacing of 600mil.



The bottom board is made to high standards in Slovakia, ensuring durability and reliability during programming, testing, and other operations involving the RENESAS DF2116VBG20MSJV FPGA device. The order number for this bottom board of BGA adapters is 70-0683, and it is designed to provide a robust and efficient solution for programming and testing of the RENESAS DF2116VBG20MSJV FPGA device in a 15x15 matrix configuration.